1. Ultrasonic cleaning principle and microscopic dirt removal ability
Ultrasonic cleaning is based on the cavitation effect. When ultrasonic waves propagate in the cleaning liquid, countless tiny cavitation bubbles are generated. These bubbles will burst instantly when they come into contact with microscopic dirt on the surface of electronic components. The strong impact force generated by the bursting of bubbles can peel off the dirt from the surface of the component. For microscopic dirt on the surface of electronic components, such as tiny metal particles, solder residues, etc., the high-frequency vibration and cavitation of ultrasonic waves can effectively act on the microscopic level. Especially for some tightly attached dirt, the impact force of cavitation bubbles can penetrate into the gap between the dirt and the surface of the component, loosening it and detaching it. However, ultrasonic cleaning also has certain limitations. For example, for some dirt that has chemical adsorption on the surface of the component, it may not be completely removed by relying solely on ultrasonic waves.
2. Sterilization and auxiliary cleaning effects of ultraviolet rays
Ultraviolet rays mainly play the role of sterilization and auxiliary cleaning in the cleaning process. The photon energy of ultraviolet rays can destroy the DNA structure of microorganisms, thereby killing bacteria and viruses, and has a good removal effect on microbial dirt that may exist on the surface of electronic components. In terms of auxiliary cleaning, ultraviolet irradiation can break the chemical bonds of some organic dirt molecules, making the structure of the dirt loose, making it easier to be removed by ultrasound or cleaning fluid. However, ultraviolet rays themselves cannot directly remove microscopic non-biological dirt, such as metal oxides, etc. It is mainly used as an auxiliary means to enhance the effect of the entire cleaning process.
3. Analysis of cleaning effect under synergy
When ultrasound and ultraviolet rays work together, the cleaning effect will be significantly improved. Ultrasonic waves peel off microscopic dirt from the surface of electronic components, while ultraviolet rays treat microorganisms and some organic dirt, while also improving the overall cleaning efficiency. Under ideal cleaning conditions, Ultrasonic U-V Cleaner can achieve a relatively thorough removal effect for common microscopic dirt on the surface of electronic components, such as dust, microorganisms, metal particles and some simple organic residues. However, if you encounter complex mixed dirt, such as both stubborn chemical adsorption dirt and microbial dirt, you may also need to combine specific chemical cleaning agents and optimize cleaning parameters, such as ultrasonic frequency, ultraviolet intensity and cleaning time, to achieve more thorough cleaning.
4. Other factors affecting the cleaning effect
In addition to the effects of ultrasound and ultraviolet rays themselves, there are other factors that affect the ability of the cleaner to remove microscopic dirt from electronic components. The first is the choice of cleaning fluid. The right cleaning fluid can enhance the cavitation effect of ultrasound and react chemically with dirt to promote the dissolution and removal of dirt. Secondly, the shape and structural complexity of electronic components are also critical. For electronic components with complex structures and many tiny gaps and holes, dirt may be hidden in these hard-to-reach areas, and even with the effects of ultrasound and ultraviolet rays, it may not be completely removed. In addition, the power of the cleaner, the cleaning time, and the placement of the components will also affect the final cleaning effect. Only by considering these factors comprehensively can the Ultrasonic U-V Cleaner be better used to remove microscopic dirt on the surface of electronic components.
